December 18, 2025, Shanghai, China – ROHM Co., Ltd., a globally renowned semiconductor manufacturer, today announced the addition of a new small-footprint HPLF5060 package (measuring 4.9mm × 6.0mm) to its lineup of low withstand voltage (40V/60V) automotive MOSFETs. Designed for applications such as main inverter control circuits, electric pumps, and LED headlamps, this new package offers higher integration and improved reliability for automotive electronics.

Compared to common packages in the automotive sector like the TO-252 (6.6mm × 10.0mm), the HPLF5060 package significantly reduces volume, contributing to more compact circuit layouts. It employs a mesh-wing type pin design to enhance mounting reliability on printed circuit boards. Combined with copper clip bonding technology, it ensures the device supports high-current operation, balancing power density with electrical performance.

Products using this package have begun mass production since November 2025 and are already available for sale through e-commerce channels. ROHM stated it will further expand the product models using this package. The company also plans to start mass production around February 2026 of an even smaller DFN3333 package (3.3mm × 3.3mm), which will incorporate wettable flank molding technology for improved solder joint visibility and process reliability.

Furthermore, ROHM has commenced development of a TOLG (TO-Leaded with Gullwing) package (measuring 9.9mm × 11.7mm) targeting high-power, high-reliability applications. This effort continues to enhance ROHM's automotive power semiconductor packaging portfolio, meeting the ongoing demands of automotive electronic systems for high efficiency, miniaturization, and superior reliability.