May 26, 2026 – SK hynix announced a new high-bandwidth memory (HBM) cooling technology called iHBM. By integrating integrated cooling components inside the HBM package, the solution significantly reduces heat generation and improves operational stability under high-load environments. According to the company, the new solution reduces thermal resistance by more than 30% compared to existing products.

iHBM places thermal control elements—named ICE (Integrated Cooling Element)—inside the D22D PHY area where heat generation is most concentrated, and establishes dedicated channels for heat extraction. ICE uses a non-conductive, high-thermal-conductivity silicon material to create an additional heat dissipation path within the package, improving HBM thermal management under high-temperature, high-load conditions.

In terms of manufacturing, iHBM employs the market-proven Advanced MR-MUF-based WLP process, enabling stable mass production. SK hynix states that the technology offers high design compatibility with customers’ existing system-in-package (SiP) environments, allowing direct adoption without major design modifications.

SK hynix plans to introduce iHBM technology starting from next-generation products such as HBM5 to meet the stricter cooling requirements of ultra-high integration and ultra-high bandwidth scenarios like high-performance computing and AI data centers, thereby improving overall system stability and operational efficiency.

“iHBM is a thermal optimization solution developed by combining memory design capabilities with advanced packaging technology, aimed at providing more timely support for customer needs in AI application environments,” said Lee Kang-wook, Vice President in charge of packaging development at SK hynix. As AI computing loads continue to grow, heat control in HBM is becoming a key factor affecting performance delivery and system reliability, and manufacturers are continuously advancing related packaging and thermal technologies.