September 11, 2025, Durham, N.C., & Shanghai, China – Wolfspeed, Inc., a global leader in silicon carbide (SiC) technology, today announced the large-scale commercialization of its 200mm SiC materials portfolio. This significant milestone marks a crucial step in Wolfspeed's mission to accelerate the industry's transition from silicon to SiC.

Following the initial provision of 200mm SiC products to select customers, which garnered positive feedback and demonstrated significant benefits, Wolfspeed has decided to commence full-scale commercialization. Wolfspeed is also simultaneously introducing readily certifiable 200mm SiC epitaxial wafers. Combined with its 200mm bare wafers, these enable groundbreaking mass production scalability and superior quality, supporting the development of next-generation high-performance power devices.

Dr. Cengiz Balkas, Chief Commercial Officer at Wolfspeed, stated, 'Wolfspeed's 200mm SiC wafers represent not just an increase in size, but a materials innovation that helps our customers confidently accelerate their device technology roadmaps. By providing high-volume, high-quality products, Wolfspeed effectively empowers power electronics manufacturers to meet the growing market demand for higher-performance, more efficient SiC solutions.'

Wolfspeed's 200mm bare SiC wafers achieve superior parametric specifications at 350 μm thickness, while the 200mm epitaxial wafers feature industry-leading, further improved doping and thickness uniformity. These characteristics enable device manufacturers to improve MOSFET yield, shorten time-to-market, and deliver more competitive solutions for automotive, renewable energy, industrial, and other high-growth applications. Furthermore, the advancements in Wolfspeed's 200mm SiC products and technology will continue to positively feedback into its 150mm SiC materials portfolio.