April 2, 2026 – Teradyne (NASDAQ: TER), a global leader in automated test equipment and advanced robotics, today announced the launch of the Omnyx breakthrough test platform. Designed specifically for printed circuit board assemblies (PCBA) and subassemblies, Omnyx addresses the unique testing requirements of AI and data center products. By integrating structural, parametric, high-speed interconnect, and functional tests into a single platform, Omnyx sets a new industry standard, solving critical manufacturing challenges, reducing defect escapes, and improving final assembly quality.

Next-generation AI and data center products are challenging traditional in-circuit test (ICT) methods. ICT focuses on structural and parametric faults introduced during assembly. However, as the complexity and value of data center assemblies continue to rise, manufacturers urgently need a comprehensive test platform capable of detecting and localizing new signal integrity and functional defects before final assembly.

Omnyx combines high-speed interconnect and mission-mode/software-guided test capabilities to deliver effective coverage of full-speed and operational defects – defects that previously could only be detected during functional test insertion. With this solution, manufacturers can identify costly defects earlier in the manufacturing process, thereby improving component and subassembly quality. This drives improvements in end-of-line yield and product quality, meeting the stringent requirements of today’s high-performance data centers.

“Teradyne Omnyx represents a major leap forward in PCBA testing, providing customers with a critical tool to address the demands of modern AI and data center hardware,” said Mark Kahwati, General Manager of Teradyne’s Circuit Board Test Division. “The platform not only enhances product quality but also shortens time-to-market – an essential factor in today’s fast-paced environment. We are proud to deliver an effective solution to our customers’ complex test challenges, enabling the industry to continue innovating in support of advanced AI applications.”

Traditional manufacturing defect testing approaches can no longer address the unique challenges of AI and data center infrastructure testing. The Omnyx platform tackles this problem head-on with a full-spectrum test strategy that integrates structural, parametric, operational, and high-speed interconnect testing capabilities, ensuring scalability while maintaining cost-effectiveness in manufacturing processes.