Teradyne (NASDAQ: TER), a global leader in automated test equipment and advanced robotics, recently announced the launch of the Photon 100, a comprehensive optoelectronic automated test platform designed specifically to accelerate high-volume production of silicon photonics (SiPh) and co-packaged optics (CPO).

Driven by the growth of AI and next-generation data centers, demand for high-speed, energy-efficient interconnects is surging. However, high-volume manufacturing of SiPh and CPO presents numerous challenges. The Teradyne Photon 100 integrates advanced optical and electrical instrumentation with the proven UltraFLEXplus platform, enabling high-throughput automated testing at all key manufacturing stages — wafer, optical engine, and co-packaged module insertion. This simplifies operations, accelerates time-to-market, and provides rapid scalability.

Key Features and Benefits:

Integrated optical and electrical test capabilities

Scalability designed for high-volume manufacturing

Comprehensive test coverage for wafer (single-sided and double-sided), optical engine, and CPO insertion

Supports standard and custom optical instrumentation

Designed, manufactured, and supported by Teradyne, reducing multi-vendor integration complexity

Open ecosystem allowing customers to choose their own high-volume manufacturing partners for probe solutions

The launch of the Photon 100 solidifies Teradyne’s leadership in high-volume SiPh and CPO testing, offering an integrated, scalable, automated solution that helps customers accelerate innovation, reduce operational complexity, and rapidly scale capacity to meet the growing demands of AI and next-generation data centers.