ROSEMONT, Ill., USA – April 21, 2026 – Littelfuse, Inc. (NASDAQ: LFUS), a leader in advanced solutions for the safe and efficient transfer of electrical energy, today announced the Littelfuse/C&K TDB Series, an ultra-miniature half-pitch surface mount DIP switch series designed to support highdensity PCB designs with demanding space, reliability, and manufacturability requirements.

As electronic systems continue to shrink, design engineers face increasing challenges in integrating configuration and addressing switches into ever tighter layouts without compromising electrical performance or assembly yield. The TDB Series addresses these challenges with a significantly reduced internal mechanism, offering a 1.27 mm halfpitch that enables higher component density while maintaining robust electrical and mechanical reliability.

The TDB Series features goldplated bifurcated contacts for stable, lowresistance signal integrity, and a toptape seal that supports automated surface mount soldering and water washing after reflow. The TDB Series complements the C&K TDA Series, expanding design flexibility for applications requiring ultracompact surface mount DIP switches.

The switches are rated up to 50 V DC, 100 mA (steadystate) and have a mechanical and electrical life of 1,000 cycles, making them suitable for reliable configuration settings in a wide range of lowpower control systems. The switches are compatible with standard SMT processes and are available in tube or tapeandreel packaging to support highvolume production environments.

“The TDB Series meets the needs of design engineers where space is limited and reliability is not negotiable,” said Jesus Santos, Global Product Manager at Littelfuse. “Its ultrasmall package, goldplated contacts, and washable sealing enable confident design even in dense, demanding applications.”